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It is used in tin plating baths and it is a precursor for tin metal.
Liu, C. R.; Pan, L. S.; Li, C. H.; Chen, H. R.; Lee, C. L. Ag/Sn Nanoparticles Reduced by Tin(II) Pyrophosphate, Tin(II) Oxalate, and Tin(II) Sulfate for Catalyzing Electroless Copper Deposition. J. Electrochem. Soc. 2015, 162, (7), D283-D290.
Meudre, C.; Ricq, L.; Hihn, J. Y.; Moutarlier, V.; Monnin, A.; Heintz, O. Adsorption of gelatin during electrodeposition of copper and tin-copper alloys from acid sulfate electrolyte. Surf. Coatings Technol. 2014, 252, 93-101.
Hazard Statements: H303
May be harmful if swallowed.
Precautionary Statements: P312a