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Copper silicide thin film is used for passivation of copper-based chips, where it serves to suppress diffusion and electromigration and serves as a diffusion barrier. It is involved in the direct process, the industrial route to organosilicon compounds.
Derek C.Johnson; James M.Mosby; Shannon C.Riha; Amy L.Prieto. Synthesis of copper silicide nanocrystallites embedded in siliconnanowires for enhanced transport properties. J. Mater. Chem. 2010, 20, (10), 1993-1998
In-Chul Kim; Dongjin Byun; Sangwha Lee; Joong Kee Lee. Electrochemical characteristics of copper silicide-coated graphite as an anode material of lithium secondary batteries. Electrochimica Acta. 2006, 52, (4), 1532-1537
Hazard Statements: H315-H319-H335
Causes skin irritation. Causes serious eye irritation. May cause respiratory irritation.
Precautionary Statements: P261-P280a-P305+P351+P338-P304+P340-P405-P501a
Avoid breathing dust/fume/gas/mist/vapours/spray. Wear protective gloves and eye/face protection. IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing. IF INHALED: Remove to fresh air and keep at rest in a position comfortable for breathing. Store locked up. Dispose of contents/container in accordance with local/regional/national/international regulations.