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Photograph of the aluminum sputtering target. Superimposed on the photograph are the annular area (shaded) used to approximate the sputter- ing area in calculating sputtered flux using Eq. Arc generation from sputtering plasma-dielectric inclusion interactions explains the effect of aluminum oxide inclusion size, shape, and orientation on the propensity for arcing during sputtering of aluminum targets.
C. E. Wickersham Jr.,; J. E. Poole1,; J. S. Fan. Arc generation from sputtering plasma-dielectric inclusion interactions . J. Vac. Sci. Technol. 2002 , A20/span>833.
C. E. Wickersham Jr. Crystallographic target effects in magnetron sputtering . J. Vac. Sci. Technol. . 1987, A5 1755