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40891 Silicon sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.999% (metals basis)

CAS Number
7440-21-3
Synonyms

Stock No. Size Price ($) Quantity Availability
40891-KS 1each 301.00
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Silicon sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.999% (metals basis)

MDL
MFCD00085311
EINECS
231-130-8

Chemical Properties

Storage & Sensitivity
Ambient temperatures.
Solubility
Insoluble in water.

Applications

Silicon sputtering target in ultra high purity silicon is used in the semiconductor industry as a result of its semiconducting properties. It is used as an alloying element in the manufacture of certain alloys (e.g. ferrosilicon, an alloy of iron and silicon which is used to introduce silicon into steel and cast iron). It is also used in the manufacture of glass and computer microchips.

Notes

Thickness tolerance: ^+0.015in; Diameter tolerance: +0.020/-0.0in

Literature References

P. C. Zalm. Energy dependence of the sputtering yield of silicon bombarded with neon, argon, krypton, and xenon ions. J. Appl. Phys. 1983, 54 2660.

Hazard Statements:

May be harmful if swallowed.

Precautionary Statements:

Call a POISON CENTER/doctor if you feel unwell.

Other References

Harmonized Tariff Code
8543.90
TSCA
Yes

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