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Step soldering involving temperature sensitive components, Soldering to molded interconnect device (MID) plastics, Fusible alloys/fuse applications, Mercury replacement, Thermal and electrical conductivity.
MF Dumke.; TA Tombrello.;RA Weller.; RM Housley. Sputtering of the gallium-indium eutectic alloy in the liquid phase. Langmuir.2013 124, (2-3) , 407-422.
A Tabatabai.; A Fassler.; C Usiak.; C Majidi. Liquid-phase gallium-indium alloy electronics with microcontact printing. Langmuir.2013 29, (20) , 6194-6200.