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45125 Palladium sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.25in) thick, 99.99% (metals basis)

CAS Number
7440-05-3
Synonyms

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Palladium sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.25in) thick, 99.99% (metals basis)

MDL
MFCD00011167
EINECS
231-115-6

Chemical Properties

Form
≈154g/target
Storage & Sensitivity
Ambient temperatures.
Solubility
Insoluble in water.

Applications

Palladium sputtering target is used for standard scanning electron microscopy (SEM) coating. It is utilized to cover as specimen with a thin layer of conducting material viz. palladium. It is needed to prevent charging of specimen with an electron beam in conventional SEM mode as well as to increase signal to noise ratio.

Notes

Typical composition of alloy: Al 95.8-98.6%, Mg 0.8-1.2%, Si 0.4-0.8%, Cr 0.04-0.35%, Cu 0.15-0.4%, Fe 0.7% max, Zn 0.25% max, Mn 0.15% max, Ti 0.15% maxIncompatible with strong acids, halogens, bases and alcohols.

Literature References

Polívková, M.; Valová, M.; Siegel, J.; Rimpelová, S.; Hubáček, T.; Lyutakov, O.; Švorčík, V. Antibacterial properties of palladium nanostructures sputtered on polyethylene naphthalate. RSC Adv. 2015, 5 (90), 73767-73774.

Gerstl, M.; Joksch, M.; Fafilek, G. The dissolution of palladium as a function of glucose concentration in chloride containing solutions of acidic pH. J. Electroanal. Chem. 2015, 741, 1-7.

Other References

Harmonized Tariff Code
8543.90
TSCA
No

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